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Items for "non-destructive test procedures"

Non-destructive strength characterization of full-wafer-bonds

This article presents a non-destructive test procedure for bond strength characterization. The approach is based on a modified blister test where the length of an artificially generated crack in combination with the applied pressure indicates the bond strength of the composite...

Keywords: MEMS, full-wafer-bonding, strength characterization, non-destructive test procedures

01/2006 | tm – Technisches Messen, Oldenbourg Wissenschaftsverlag