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Items for "ESPI"

Electronic Speckle Pattern Interferometry for the Characterization of Microsystem Packages

For the characterization of microsystem packages a highly precise and interaction free measuring technique is needed...

Keywords: MEMS, optical measuring techniques, deformation analysis, ESPI, Thermal expansion

05/2006 | tm – Technisches Messen, Oldenbourg Wissenschaftsverlag
Load Analysis of Electronic Systems

Electronic systems and their components are exposed to manifold and harsh environmental conditions in automotive applications...

Keywords: automotive electronics, field loads, humidity, testchip, ESPI

02/2008 | tm – Technisches Messen, Oldenbourg Wissenschaftsverlag