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Items for "deformation analysis"

Electronic Speckle Pattern Interferometry for the Characterization of Microsystem Packages

For the characterization of microsystem packages a highly precise and interaction free measuring technique is needed...

Keywords: MEMS, optical measuring techniques, deformation analysis, ESPI, Thermal expansion

05/2006 | tm – Technisches Messen, Oldenbourg Wissenschaftsverlag
Thermomechanical Loading Setup for the Analysis of Micro Materials Parameter in MEMS Compounds

The reliability of MEMS is influenced strongly by thermomechanical aging and failure mechanisms, acting as the main reason for defects in real applications...

Keywords: MEMS, loading equipment, deformation analysis, reliability, numerical simulation

05/2006 | tm – Technisches Messen, Oldenbourg Wissenschaftsverlag
Gridline methods for detection of object displacements and rigid body movements

If measurements are performed without artificial targets, deformation analysis cannot refer to the points on the objects defined at an initial or prior measurement epoch...

Keywords: Theodolite measurement systems, deformation measurements, deformation analysis, object tracking, gridline methods

01/2008 | Journal of Applied Geodesy, Walter de Gruyter