For the characterization of microsystem packages a highly precise and interaction free measuring technique is needed...
Keywords: MEMS, optical measuring techniques, deformation analysis, ESPI, Thermal expansion
05/2006 | tm Technisches Messen, Oldenbourg WissenschaftsverlagThe reliability of MEMS is influenced strongly by thermomechanical aging and failure mechanisms, acting as the main reason for defects in real applications...
Keywords: MEMS, loading equipment, deformation analysis, reliability, numerical simulation
05/2006 | tm Technisches Messen, Oldenbourg WissenschaftsverlagIf measurements are performed without artificial targets, deformation analysis cannot refer to the points on the objects defined at an initial or prior measurement epoch...
Keywords: Theodolite measurement systems, deformation measurements, deformation analysis, object tracking, gridline methods
01/2008 | Journal of Applied Geodesy, Walter de Gruyter