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Oliver Köster, Johann Slotkowski, Dirk Brögger

On-Wafer Calibration for Pressure Sensors

Portability is expected to continue being a strong driver of new packaging approaches and the area saved on a PWB make new product features possible that can be used for sales promotion. For example altimeters and barometers are incorporated already in clocks and pocket knives [1; 2]. So there is a need of fully linearized pressure sensor systems with small temperature drift and small form factor, i. e. calibrated pressure sensors ideally for flip-chip assembly. Since the handling of chip scale packaged pressure sensors is quite complicated new calibration strategies have to be developed. FhG-IMS Duisburg has set up a method for on-wafer calibration of integrated pressure sensors.

tm – Technisches Messen, Oldenbourg Wissenschaftsverlag

Print ISSN: 0171-8096
Volume: 70, 05/2003
Pages: 265

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