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Michael Dost, Bettina Seiler, Rolf Erb

Thermomechanical Loading Setup for the Analysis of Micro Materials Parameter in MEMS Compounds

Keywords: MEMS, loading equipment, deformation analysis, reliability, numerical simulation

The reliability of MEMS is influenced strongly by thermomechanical aging and failure mechanisms, acting as the main reason for defects in real applications. The stability of the materials and interface properties in the structured compounds is essential for the behaviour in very long lifetime applications of MEMS. By coupling of experimental deformation analysis by means of high resolution optical methods with thermal, mechanical or thermomechanical loading and numerical simulation it is possible to evaluate material properties and parameters and to analyze the physical nature of failure and degradation mechanisms. A thermal loading unit designed for such applications is presented.

tm – Technisches Messen, Oldenbourg Wissenschaftsverlag

Print ISSN: 0171-8096
Volume: 73, 05/2006
Pages: 293 - 300

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