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Jürgen Wilde, Erik Deier

Thermomechanical Effects of the Adhesive Die Attachment on the Accuracy of MEMS Pressure Sensors

Thermo-mechanical loads can strongly affect the function of mechanical-electrical microsystems. In this paper we will regard two aspects of this issue. It will be demonstrated how the deformation mechanisms of adhesive die attachments will influence the functional sensor behavior. First, the focus will lie on the modelling of suitable material laws. In the second part we will utilize such material data to predict the accuracy of a MEMS pressure gauge. FE simulations on the basis of the thermo-mechanical behavior of the die attachment show that the long-term stability of a pressure gauge signal is significantly affected by the deformation models of the adhesive.

tm – Technisches Messen, Oldenbourg Wissenschaftsverlag

Print ISSN: 0171-8096
Volume: 70, 05/2003
Pages: 251

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