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Hans Reinhard Schubach

Electronic Speckle Pattern Interferometry for the Characterization of Microsystem Packages

Keywords: MEMS, optical measuring techniques, deformation analysis, ESPI, Thermal expansion

For the characterization of microsystem packages a highly precise and interaction free measuring technique is needed. Optical measuring techniques can deliver an important contribution. Due to its high resolution the Electronic Speckle Pattern Interferometry is well suited for the mechanical and thermal characterization with high precision as well as for full field.

tm – Technisches Messen, Oldenbourg Wissenschaftsverlag

Print ISSN: 0171-8096
Volume: 73, 05/2006
Pages: 266 - 274

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