You are here: Home :: Area NEM :: Engineering :: Machine construction

Martin Rabold, Alexander Doll, Michael Kröner, Frank Goldschmidtböing, Peter Woias

Non-destructive strength characterization of full-wafer-bonds

Keywords: MEMS, full-wafer-bonding, strength characterization, non-destructive test procedures

This article presents a non-destructive test procedure for bond strength characterization. The approach is based on a modified blister test where the length of an artificially generated crack in combination with the applied pressure indicates the bond strength of the composite. For geometry determination, different test structures were analyzed. Thereby, the pressure independent ratio between volume displacement and newly generated crack area during proceeding crack propagation is the determining factor for a non-destructive test character.

tm – Technisches Messen, Oldenbourg Wissenschaftsverlag

Print ISSN: 0171-8096
Volume: 73, 01/2006
Pages: 043 - 050

Show full article (external site)

Show all available items of this journal

 

Area NEM