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Michael Dost, J. Vogel, R. Döring

A Thermal Loading Device for Local Parameter Determination at Microcomponents

Local material parameters in microtechnical compounds and components can be determined by comparing experimental results with results of numerical simulation (parameter identification). Microscopic dimensions of the objects under investigation and very small deformations are typical conditions that have to be taken into account by using measurement methods with high accuracy and resolution and a loading equipment with excellent thermal and mechanical stability. Especially for digital holography, but also for other optical measuring methods (structured light, gray scale correlation) a loading device has been developed and constructed which widely avoids external error influences such as vibrations, optical discontinuities caused by thermal induced air turbulence, and undesirable thermal induced shifts of the components of the loading device itself. These features allow the inspection of the behaviour of microstructures under well defined thermal or thermomechanical loading conditions.

tm – Technisches Messen, Oldenbourg Wissenschaftsverlag

Print ISSN: 0171-8096
Volume: 68, 02/2001
Pages: 61

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