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Karl-Heinz Brenner, Ulrich Krackhardt

Components and Assembling Techniques for micro-optical Systems designed for Signal Transmission and Processing

The fundamental limitations on the performance of today′s data processing systems can be substantially extended by combining optical and electronic interconnects. This requires opto-electronic components for conversion between electronic and photonic signal carriers. Optical systems have to fulfill demanding conditions in terms of ruggedness and integration potential. The manufacturing techniques for micro-optical components have to share the standard techniques of micro-electonics as much as possible in order to achieve an inexpensive integration of optical sub-systems into electronic systems. Manufacturing and testing methods of micro-optical components are discussed. A parallel fiber plug is presented with reduced alignment requirements for connecting mono-mode fibers. The integration potential due to the usage of micro-optical components is shown by discussing a biomedical optical sensor. A multiplexed fiber optical interconnect is presented for broad band and parallel short distance signal transmission.

it – Information Technology (vormals it+ti), Oldenbourg Wissenschaftsverlag

Print ISSN: 1611-2776
Volume: 41, 06/1999
Pages: 39

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